Han’s Laser UV depaneling is widely used for diverse of Printed Circuit Boards, which help the customer create productivities and profit.
FPCB, Material: PI, Thickness: 80μm
Material: PI+Copper foil, Thickness: 25-150μm
PCB, Material: FR4, Thickness: 0.012 inch
Material: FR4, Thickness: 0.023 inch
Material: FR4, Thickness: 0.043 inch
Fingerprint Sensor IC, Material: FR4+Packing Material, Thickness: 0.031 inch
For more information about UV Laser Depaneling, please contact us.
laser@hanslaser.com
408-774-9428
