The microelectronics industry, encompassing integrated circuits (ICs), upstream materials, downstream packaging and application manufacturers, as well as manufacturing equipment suppliers, plays a pivotal role in advancing high-tech sectors such as artificial intelligence, biotechnology, and semiconductor technologies. As the industry undergoes rapid growth and consolidation, innovation in microelectronics has become a driving force behind technological progress worldwide.

Han’s Laser remains committed to its strategic vision of “leading foundational device technologies and deepening application in industry equipment.” Seizing the opportunity presented by the fast-growing microelectronics sector, accelerated product iterations, and evolving industrial layouts, Han’s Laser focuses on accelerating integrated circuit and microelectronics applications through technological innovation and resource collaboration. This approach aims to help the microelectronics industry climb to higher value chains and establish itself as a technology stronghold.

Laser Marking in Microelectronics

1.Wafer Marking

To meet increasingly stringent quality control and process improvement demands—and to enable efficient management and traceability during subsequent manufacturing and testing—high-precision laser marking machines are used to engrave clear, legible characters, 1D barcodes, or QR codes on wafer or die surfaces.

Each marking contains vital data such as manufacturer-specific codes and unique wafer or die serial numbers, ensuring traceability and uniqueness throughout the production line.

Processing Advantages:

• Fully automated operation with dual-arm robotic handlers significantly improves throughput.
• Integrated power monitoring and post-marking inspection systems ensure consistent marking quality.
• Optional Loadport/SMIF loading modules enhance flexibility and adaptability.

Applications:

• Fully automated wafer ID and die marking
• Transparent film marking on wafers
• Compatible with both front-side and backside wafer laser marking processes

2.Chip Decapsulation

Chip decapsulation is critical during chip design and R&D phases, enabling the removal of localized plastic encapsulation without damaging the substrate or circuitry. This non-contact, high-precision, rapid laser peeling method offers improved accuracy and yield compared to traditional chemical decapsulation, while also being more environmentally friendly. It applies to a wide range of packaging materials and is widely used for chip and electronic component testing.

Processing Advantages:

• Suitable for up to 99% of packaging materials.
• Equipped with a 5MP high-resolution camera for precise localization, ensuring bond wires remain intact.
• Dedicated decapsulation software provides real-time monitoring of the process.

Applications:

• Failure mode analysis: Enables detailed electrical and physical testing to identify chip failure mechanisms and inform design improvements.
• Fault localization: Exposes internal chip structures for direct inspection and precise fault identification using laser ablation or chemical etching.
• Sample preparation and observation: Facilitates optical microscope examination to better understand chip function and performance.
• Research and development: Validates design accuracy and reliability by providing feedback through direct analysis of decapsulated chips.

3.Chip Marking

Processing Advantages:

• Fully automated operations dramatically enhance production efficiency. Features include pre-marking inspections and post-marking verification to guarantee quality.
• Utilizes high-precision motion control and visual positioning systems to meet stringent chip packaging marking requirements.

Applications:

• Positioning and alignment: Essential during multiple semiconductor manufacturing steps (photolithography, etching, deposition) to ensure pattern accuracy across layers.
• Anti-counterfeiting and traceability: Stores unique identifiers or serial numbers on chips to protect against counterfeit products and enable full lifecycle tracking, enhancing quality control and after-sales service.

Laser Cutting in Microelectronics

SIP Chip Grooving

System-in-Package (SIP) laser grooving is widely used in SIP chip manufacturing to create diverse groove profiles such as T-slots, through-slots (I-shaped), V-slots, and Y-slots. These precise groove shapes are vital for meeting the varied packaging requirements of SIP technology.

By carefully controlling laser power density, cutting speed, and focal position, grooving is performed with high accuracy and consistency. The resulting grooves feature smooth, clean internal surfaces without residue, and crucially, the underlying copper layer remains intact and undamaged, preserving both the structural integrity and electrical performance of the package.

Compared to traditional mechanical cutting, laser grooving offers higher precision and faster processing speeds, boosting overall manufacturing efficiency. The excellent surface quality post-grooving eliminates the need for secondary processing, improving package quality and throughput.

Processing Advantages:

• Fully automated with proprietary control software, precision motion systems, galvanometer scanning mirrors, and vision-based positioning.
• Supports multi-panel cutting, auto-focus adjustment, and expansion/contraction compensation for ultra-precise machining.

Conclusion

In today’s fast-evolving information era, the microelectronics industry remains a strategic high ground for global technological leadership and a comprehensive indicator of advanced manufacturing capabilities. Han’s Laser is dedicated to leveraging this critical growth window to accelerate the diversification and visualization of industry applications.

By continually investing in innovation, advanced technologies, talent, and resources, Han’s Laser is breaking through external and internal technology bottlenecks. This enables mastery of core manufacturing technologies and fosters an integrated industrial ecosystem that supports sustainable growth in microelectronics and beyond.

For inquiries about Han’s Laser solutions for microelectronics, please contact us to explore how our advanced laser marking and cutting technologies can help your business stay at the forefront of innovation.