Introduction
Metal grooving plays a critical role in semiconductor manufacturing, especially for advanced devices such as VCSEL chips and BAR products. However, traditional grooving solutions often face challenges including low processing efficiency, high consumable costs, large equipment footprints, and complex maintenance requirements.
To address these challenges, Han’s Laser has developed the DA100-A7 laser metal grooving system, a next-generation platform specifically designed for semiconductor wafer processing. By integrating advanced laser technology, optimized process control, and intelligent hardware architecture, the DA100 provides a more efficient and cost-effective solution for metal grooving applications.
For SiC backside metal grooving processes, the DA100 can achieve a “one machine replacing two traditional systems” capability, significantly improving production efficiency while reducing overall manufacturing costs.
High-Efficiency Laser Metal Grooving for Semiconductor Applications
The DA100-A7 is designed for precision processing of semiconductor materials including:
- Gallium arsenide (GaAs)
- Indium phosphide (InP)
- Silicon (Si)
It is widely used in semiconductor applications such as:
- VCSEL chip manufacturing
- BAR laser chip processing
- Wafer backside metal grooving
- Precision wafer cutting processes
The system supports wafer sizes from 4-inch, 6-inch, to 8-inch, with processing thickness capability ranging from 50 μm to 200 μm.
With high mechanical precision, the DA100 achieves:
- Straightness accuracy: ±1 μm
- Repeat positioning accuracy: ±1 μm
This enables stable and repeatable processing performance for high-value semiconductor devices.
Key Technology Advantages of DA100-A7
1.2–3× Higher Productivity Compared with Traditional Systems
The DA100-A7 significantly improves production efficiency through optimized laser processing technology.
For SiC backside metal grooving applications:
- 20–40 μm groove width
- Single-pass processing capability
- Higher throughput compared with conventional solutions
The production output of one DA100 system can equal two traditional machines, helping manufacturers increase capacity while reducing equipment investment.
2.Advanced Process Performance with Superior Groove Quality
The DA100 delivers high-quality grooves with:
- Sharp and uniform groove profiles
- Reduced heat affected zone (HAZ)
- Improved edge quality
- Stable process consistency
The system supports glue-free processing, eliminating additional coating steps and reducing:
- Process complexity
- Material consumption
- Production losses
This streamlined workflow helps semiconductor manufacturers improve yield and reduce operating costs.
3.Flexible Multi-Material and Multi-Process Compatibility
To support diverse semiconductor manufacturing requirements, the DA100 features a self-developed multi-optical-path system.
Key capabilities include:
- Compatibility with multiple wafer materials
- Support for front-side and backside metal grooving
- Flexible process adaptation for different applications
The system can also be equipped with a dual laser configuration combining nanosecond and femtosecond lasers, providing additional flexibility for advanced semiconductor processing requirements.
Intelligent System Design for Stable Manufacturing
The DA100-A7 incorporates multiple technologies designed to improve reliability and production consistency.
Automated Coating and Cleaning System
The newly developed automatic coating and cleaning system provides:
- Precise control of adhesive application
- Reduced material waste
- Improved process stability
Advanced Dust Collection and Filtration
Laser processing may generate fine particles and potentially hazardous dust. The DA100 integrates a multi-stage filtration system to:
- Efficiently collect processing dust
- Improve workplace safety
- Maintain a cleaner production environment
Optimized Software and Hardware Architecture
The upgraded software platform and high-quality hardware components ensure:
- Consistent processing parameters
- Reliable data management
- Improved equipment stability
The system is also designed to meet SEMI S2 safety certification requirements, supporting semiconductor manufacturers’ compliance needs.
Lower Total Cost of Ownership
Beyond productivity improvements, the DA100-A7 provides significant lifecycle cost advantages.
Compared with traditional equipment:
- Maintenance cost reduced by up to 60%
- Floor space requirements reduced by up to 60%
The compact design helps manufacturers maximize cleanroom utilization while lowering infrastructure investment.
Combined with reduced consumable usage and higher throughput, the DA100 offers a strong return on investment for semiconductor production lines.
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MPW Dicing Results | Post-Dicing Expansion Results | Cross-Sectional View |
Conclusion
The Han’s Laser DA100-A7 represents advanced laser metal grooving technology, combining high precision, flexible material compatibility, and improved manufacturing efficiency.
With capabilities including 2–3× productivity improvement, dual laser support, precise wafer processing, and significantly reduced operating costs, the DA100 provides semiconductor manufacturers with a reliable solution for VCSEL, BAR, SiC, and other advanced wafer applications.
As semiconductor devices continue to evolve toward higher performance and smaller dimensions, advanced laser processing platforms like the DA100 will play an increasingly important role in enabling efficient and precise manufacturing.