Silicon carbide (SiC) chips are rapidly reshaping the landscape of modern electronics, powering advancements in electric vehicles, radar systems, 5G communication, and smart grids. As a next-generation semiconductor material, SiC offers exceptional thermal conductivity, high voltage resistance, and superior switching performance. However, its inherent hardness also makes it notoriously difficult to process using traditional slicing methods like multi-wire saws—especially as the industry transitions from 6-inch to 8-inch and even 12-inch wafers.

Traditional slicing techniques are now facing critical bottlenecks: excessive material loss, slow throughput, and unsustainable processing costs. This is where laser slicing technology is stepping in as a disruptive solution—offering a more precise, efficient, and cost-effective alternative for slicing large-diameter SiC ingots.

The Rise of Laser Slicing in SiC Wafer Manufacturing

Laser slicing, also known as laser exfoliation or laser wafering, enables non-contact separation of wafers from SiC ingots by leveraging controlled laser energy to peel off single substrate layers. Unlike mechanical wire sawing, which consumes significant material, this method minimizes kerf loss and enhances overall yield.

Han’s Laser has taken this technology further with its proprietary QCB (Qian Ceng Bing) laser slicing solution, achieving new benchmarks in precision and performance. Their system is capable of slicing 8-inch, 350μm-thick conductive SiC substrates with:

• Single-wafer material loss < 70–80μm
• Total material consumption < 450–470μm per wafer
• Throughput of 15 minutes per wafer
• Output of up to 42–44 wafers from a 20mm ingot

This marks a substantial improvement over traditional slicing, not just in material efficiency but also in cost control and equipment lifespan.

Key Benefits of Han’s Laser Slicing System

1.Ultra-Low Cutting Loss

By precisely controlling the laser interaction with the crystal structure, Han’s Laser reduces kerf and subsurface damage. For an 8-inch SiC wafer, total loss is limited to under 80μm, maximizing the usable yield from every ingot.

SiC Ingot Laser Slicing Production Line Automation Equipment

2.High Throughput

Processing time is reduced to under 15 minutes per wafer, enabling faster cycle times and improved production efficiency—especially important as wafer sizes increase.

3.Reduced Consumable Wear

Laser separation creates smooth, low-roughness surfaces, minimizing the need for aggressive back-end grinding. Compared to industry standards, abrasive wear on grinding wheels is reduced by up to 40%, extending tool life and lowering maintenance costs.

4.Smart Automation and Modular Flexibility

Han’s Laser integrates advanced automation into its slicing production line, ensuring seamless handling from loading to unloading. The system supports both 8-inch and 12-inch wafers and can be flexibly scaled to match varying production demands, minimizing floor space while maximizing throughput.

Advanced Production Line for SiC Ingot Slicing

The slicing production line incorporates:

• Precision process control to ensure stable, consistent output
• Real-time quality monitoring to detect abnormalities during processing
• Modular design to allow easy adaptation and expansion as demand grows
• Each component is optimized for synergy—creating a smooth, high-efficiency operation from end to end.

Full-Process Technology Application of QCB Technique

Leading the Future of SiC Wafer Processing

Han’s Laser is committed to pushing the boundaries of semiconductor manufacturing through technological innovation and process excellence. With its advanced laser slicing system, Han’s Laser is not only improving SiC wafer yields and cutting times—it’s redefining what’s possible in semiconductor fabrication.

As the industry continues to demand larger wafers, higher yields, and smarter automation, Han’s Laser stands ready to deliver. By investing in innovation, minimizing cost per wafer, and optimizing every step of the slicing process, Han’s Laser helps manufacturers unlock the full potential of SiC technology.

Contact Han’s Laser to learn more about next-generation solutions for SiC wafer production.