As the semiconductor industry accelerates through rapid technological evolution, chip integration density continues to soar, wafer sizes trend toward larger formats, and material systems diversify with increasing complexity. Against this backdrop, advanced scribing and cleaving solutions offer vital flexibility to meet the diverse manufacturing demands, securing their critical role within the semiconductor supply chain.
Building on deep technical expertise and insightful market foresight, Han’s Laser proudly introduces the DC-CP8060 Fully Automated Compound Chip Cleaving and Scribing Line (hereafter referred to as the “DC-CP8060 system”). After rigorous validation, this system precisely aligns with the complex requirements of semiconductor fabrication, injecting continuous innovation into the industry’s development.
Fully Automated Compound Chip Cleaving and Scribing System
Application Scope
The DC-CP8060 system finds extensive application across cutting-edge chip sectors, including optical devices, laser chips, and optical communication chips. It supports a wide range of semiconductor materials such as GaAs, InP, GaN, and SiC, addressing the increasingly diverse material landscape in semiconductor manufacturing.
Key Advantages
The DC-CP8060 employs an integrated, fully automated process featuring diamond scribing, PET film application, and precise cleaving — with scribing depth controlled below 3μm and scribing width between 3 to 5μm. The system delivers significant benefits including:
1.High-Cleanliness Operation
- Incorporates a newly added FFU (Fan Filter Unit) clean environment system for superior contamination control.
- Entire production process requires no water washing, minimizing contamination risk.
- Utilizes a dry, cold processing technique, effectively eliminating thermal impact on the product surface during machining.
2.Maximized Product Utilization
Achieves ultra-narrow cutting streets as small as 12μm, optimizing wafer real estate and increasing yield.
3.Broad Product Compatibility
- Supports fully automated processing for laser chips and optical communication chips across the wafer-to-CELL-to-BAR-to-CHIP flow.
- Fully compatible with different product sizes and specifications.
4.Multi-Material Adaptability
Handles diverse semiconductor materials including GaAs, InP, GaN, and SiC.
5.Integrated Functionality
Combines cutting, PET film application, and cleaving into one seamless, fully automated production line.
Equipment Parameters
| Wafer Substrate | GaAs, InP, GaN, SiC, and Si substrates |
| Wafer Size Range | 4-inch / 6-inch / 8-inch |
| Bar Chip | Bar size: ≥ 4.5 mm × 30 mm Single chip size: ≥ 0.10 mm × 4.5 mm |
| X-Y Axis | 160mm*160mm |
| F Axis | Travel stroke: 55 mm, Movement resolution: 1 µm |
| Transfer System | Load port, robot, aligner |
Scribing and Cleaving Principles
1.Diamond Scribing Process
Han’s Laser DC-CP8060 system calibrates the diamond scribing blade angle, force, and blade type precisely according to material and process needs. The diamond blade creates micro V-grooves on the product surface (less than 3μm deep), with depth finely controlled based on wafer thickness. This precise scribing ensures effective grain separation while maintaining wafer integrity.
Principle of Diamond Scribing Process
2.Cleaving Process
Utilizing a three-point bending principle, the cleaving process achieves consistent chip separation through standardized procedures:
- Position Calibration: A high-precision vision system continuously aligns the cleaving position, achieving micron-level accuracy.
- Mechanical Fracture: The product is placed on an adjustable support stage, where a cleaving blade (with a cutting edge width of 5–10μm) rapidly presses down, causing the wafer to fracture precisely along the scribed lines, producing uniformly sized chips.
Manufacturing Process
Scribing and Cleaving Effect
Conclusion
With its extensive application range, distinct equipment advantages, and scientifically engineered scribing and cleaving principles, Han’s Laser DC-CP8060 fully automated compound chip cleaving and scribing system stands as a groundbreaking innovation propelling the semiconductor industry’s rapid progress. Looking ahead, Han’s Laser remains firmly committed to innovation as its core driving force, continuously empowering industry transformation. Leveraging forward-thinking technology strategies, the company will persistently optimize and upgrade its product portfolio, leading semiconductor manufacturing toward higher quality and enhanced efficiency.