Features
The infrared picosecond laser marking machine is a no-contact, narrow pulse width ultra-fast process technique. It is a turnkey marking and cutting system. Nearly accommodate almost all types of medical products can be laser marked, including implants, surgical instruments and disposable products such as cannulas, catheters, and hoses.
Compared with the traditional nanosecond laser (10^-9s), the picosecond laser engraving machine has high processing accuracy, minimal thermal effect, and no burrs on the processing edge.
Picosecond lasers have been widely used in fine micromachining fields with the advantage of high peak power and narrow pulse width (10^-12s). Such as LED chip dicing, solar photovoltaics, rainbow color on stainless steel, titanium, and anodized aluminum black marking.
- Support CAD file format(DXF)/ PLT/BMP/JPG/AI.
- Able to mark 1D, 2D bar code, GS1 code, Series numbers, Batch number, Logo, Company information.
- Laser marking software could be customized to meet the customer’s unique demand.
- The software supports Serial Port and TCP/IP communication with the client-server.

Application and Samples
– UDI marking of medical device





Technical Specs
Laser Type | Picosecond Laser |
Wavelength | 1064 nm (nominal) |
Min Beam Diameter | < 10 µm |
Beam Quality M2 | < 1.2 |
Pulse Frequency | 10 – 1000 kHz |
Output Power | 30 Watts |
Repetition Accuracy | ± 0.0001” (0.003mm) |
Cooling System | Fully Water Cooled |
Marking Field Size | 3.93″ x 3.93″ (100mm x 100mm) |
Operation System | WINDOWS 10 |
Laser Safety Level | Class I |
Electrical Connection | 110 – 230 V (± 10%) 16 A, 50/60 Hz |
Power Consumed | 2KW |
Dimensions | 32”L x 1117”W x 68”H (812mm x 863mm x1727mm) |
Weight (Unpacked) | 980 lbs (445kg) |
Warranty Coverage | 1-year |
Laser Safety Compliance | FDA(CDRH) |
Running Temperature | 15℃-35℃ / 59°-95°F |
Options and Accessories
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