In the ever-evolving field of semiconductor technology, the demand for reliable and efficient decapsulation processes is paramount. Han’s Laser, a leading manufacturer in laser systems, has introduced an advanced chip decapsulating machine that revolutionizes the decapsulation process. This cutting-edge machine is designed to decapsulate chips with precision and consistency, offering a host of features that ensure high repeatability and accuracy.
In this essay, we will explore the key features and benefits of Han’s Laser chip decapsulating machine, which include its wide applicability to various packaging materials, CNC-controlled XYZ axes, high-resolution cameras for precise positioning, real-time color vision system, and dedicated unsealing software.
Laser Chip Decapsulating Machine Equipment Structure
1.Wide Applicability to Packaging Materials
The Han’s Laser chip decapsulating machine is engineered to handle up to 99% of packaging materials commonly used in the semiconductor industry. Whether it is ceramic, plastic, or metal packaging, this machine ensures versatility and adaptability, making it suitable for a wide range of applications. The ability to work with different packaging materials streamlines the decapsulation process and improves productivity.
2.CNC-Controlled XYZ Axes for Precise Positioning
The chip decapsulation process demands precise positioning to ensure accurate decapsulation of the chip without causing any damage. Han’s Laser chip decapsulating machine features XYZ axes that are completely controlled by Computer Numerical Control (CNC) technology. This advanced control system allows for precise movement and positioning of the chip, ensuring that the decapsulation process is executed with high accuracy and repeatability.
Laser Chip Decapsulating Machine OS Demo
3.High-Resolution Cameras for Precise Bonding Line Preservation
To achieve optimal results, the chip decapsulation machine employs multiple 5Mp independent high-resolution cameras. These cameras are integrated into the system to facilitate precise positioning and ensure the preservation of the bonding line during the decapsulation process. The high-resolution imagery allows for detailed inspection and precise control over the decapsulation parameters, resulting in consistent and reliable decapsulation outcomes.
4.Real-Time Color Vision System for Continuous Monitoring
The chip decapsulating machine is equipped with a real-time color vision system that provides continuous monitoring of the etching process. This vision system allows operators to observe the etching progress in real time, ensuring that the decapsulation is carried out accurately and efficiently. By enabling real-time monitoring, potential issues or deviations can be detected promptly, minimizing the risk of errors and optimizing the overall decapsulation process.
Laser Chip Decapsulating Machine OS Demo
5.Dedicated Unsealing Software for Real-Time Process Detection
To enhance the accuracy and control of the decapsulation process, the machine is equipped with dedicated unsealing software. This software plays a crucial role in real-time process detection, ensuring that the decapsulation process is executed correctly. The software monitors and analyzes various parameters, such as etching time, temperature, and pressure, providing instant feedback to the operator. This real-time feedback enables operators to make immediate adjustments if required, resulting in consistent and reliable decapsulation outcomes.
Laser Chip Decapsulating Machine Sample
Han’s Laser chip decapsulating machine represents a significant advancement in semiconductor technology. Its wide applicability to different packaging materials, CNC-controlled XYZ axes, high-resolution cameras, real-time color vision system, and dedicated unsealing software collectively contribute to its outstanding performance and reliability.
With this machine, semiconductor manufacturers can achieve precise and consistent decapsulation results, leading to improved product quality, increased productivity, and enhanced process control. As the semiconductor industry continues to advance, the Han’s Laser chip decapsulating machine stands as a valuable tool in meeting the demanding requirements of chip decapsulation.