Han’s Laser is a leading Chinese manufacturer of laser equipment and systems. Among many products, one of Han’s most innovative and exciting technologies is laser wafer dicing and ring removal system.
Traditional wafer dicing techniques rely on mechanical methods such as sawing or grinding, which can be time-consuming, inaccurate, and prone to causing damage to the wafers. By contrast, Han’s Laser’s laser wafer dicing technology uses high-precision lasers to cut and remove wafers quickly and accurately, while minimizing damage to the wafer.
Laser wafer dicing works by using a high-powered laser to create a series of micro-cracks in the wafer along the desired cutting path. These micro-cracks propagate through the wafer until they meet, causing the wafer to separate along the cutting path. This process allows for the creation of very precise cuts, even in very thin wafers.
Han’s Laser’s laser wafer dicing system is capable of handling a wide variety of wafer materials, including silicon, gallium arsenide, indium phosphide, and sapphire. The system is also highly customizable, allowing for the creation of complex cutting patterns and shapes.
One of the key advantages of Han’s Laser’s laser wafer dicing technology is its ability to reduce material loss during the cutting process. Traditional mechanical dicing methods can result in significant material loss due to the kerf width of the saw blade or grinding wheel. Laser dicing, by contrast, can produce much narrower cuts, reducing the amount of material lost in the process.
Another important benefit of laser wafer dicing is its ability to reduce damage to the wafer during the cutting process. Traditional mechanical dicing methods can cause microcracks, chipping, or even breakage of the wafer, particularly in thin wafers. Laser dicing, by contrast, can produce clean, precise cuts without causing damage to the wafer.
In addition to laser wafer dicing, Han’s laser system also includes a ring removal feature. During the wafer manufacturing process, a ring of material is often left around the edge of the wafer to support it during handling and processing. This ring must be removed before the individual chips can be separated from the wafer.
TAIKO wafer: cutting thickness 150um, kerf 11um, dust area 220um, kerf clean, no obvious slag
Traditional ring removal methods typically involve mechanical grinding or sawing, which can be time-consuming and damage the wafer. Han’s Laser’s ring removal feature uses a high-powered laser to selectively remove the ring of material around the edge of the wafer. The laser is able to precisely control the depth and width of the cut, allowing for a clean, precise removal of the ring without damaging the wafer.
Overall, Han’s Laser’s laser wafer dicing and ring removal technology offers a number of benefits over traditional mechanical methods. Its ability to produce precise cuts while minimizing damage and material loss makes it an attractive option for manufacturers of a wide range of electronic devices. As the demand for ever-smaller, more powerful electronic components continues to grow, it is likely that we will see increasing adoption of this technology in the coming years.