Introduction
In recent years, the semiconductor industry has witnessed continuous technological upgrades in manufacturing processes, necessitating stricter control over wafer quality. To achieve traceability throughout the entire lifecycle of wafer processing, clear characters, one-dimensional codes, or two-dimensional codes can be laser-marked on the surface of wafers or chips, providing them with a distinctive “identification card.” For real-time traceability, these marks must be readable throughout the manufacturing process, posing higher demands on wafer laser marking machine.
Laser marking employs a high-energy beam for non-contact irradiation of the workpiece, ensuring the rapid completion of marking instructions while preserving the original precision of the workpiece and avoiding damage due to pressure. Laser marking, with its advantages of high efficiency, precision, performance, and no consumables, has become the preferred technology for wafer marking.
Empowering Precision Manufacturing with Advanced Technology
To meet the precise laser marking requirements on wafers, Han’s Laser has dedicated itself to the research and development of a fully automatic wafer laser marking machine series. Leveraging sophisticated laser technology, Han’s Laser uses advanced techniques to empower precision manufacturing.
In 2023, Han’s Laser launched the latest addition to the fully automatic (WM-N6) series – the fully automatic wafer laser marking machine WM-N6123A. Building on the technological advantages of the WM-N6 series, the WM-N6123A meets diverse customer production needs to high standards. Furthermore, it can be customized to provide the most suitable solutions, gaining widespread attention and applications in the semiconductor industry.
1.Application Areas
Laser marking on semiconductor wafers enables the marking of letters, numbers, barcodes, QR codes, and various characters on materials such as silicon, EMC, back gold (T1/1K, NI/1K, AG/100K, NI/0.5K), etc.
2.Key Features
Translucent marking on wafers (supports blue film, white film translucent marking), front-side marking, back-side marking, ID marking, DIE marking.
Compatible with 8-12 inch bare wafers and 8-12 inch ring wafer.
Supports various character types such as letters, numbers, barcodes, and QR codes.
Fully automatic loading and unloading, utilizing a high-precision robotic arm with vacuum adsorption for accurate positioning.
Efficient detection system for content and position inspection after marking.
Capable of receiving customer marking mapping data and implementing various skip code functions.
Can be networked with customer company systems, supporting SECS/GEM functions.
3.Key Parameters
Laser wavelength: 532nm.
ID marking accuracy: ±150μm.
DIE marking accuracy: ±75μm.
Wafer size: 8-12 inches.
Si Wafer ID particle increment: 0.3um≤15 particles (depth≤1.5um).
Dimensions (L×W×H): 2503×1801×2028mm.
4.Processing Effects
4.1Front-side marking.
4.2Back-side marking (with film).
As laser technology continues to develop and innovate, Han’s Laser seizes industry development opportunities. The company delves into research and expansion of laser processing technology and applications for wafers, consistently introducing cutting-edge laser solutions centered around wafer manufacturing processes, achieving efficient production management.
In the future, Han’s Laser will continue to play a leading role in process technology, continuously innovating in the field of laser applications, with a focus on “new technology, new processes, and new products.”