● A turn-key design.
● A 2D bar code and serial numbers can be marked with the machine.
● SW control can quickly process any complex contours, no die cost.
● PCBA processing is achievable.
● The cutting capacity of the machine is up to 0.004″ to 0.07″ thickness.
● Selectable working field size and laser power to meet specific demand.
Features
The HDZ-UVC3030 Laser PCB Depaneling Machine stands out in precision machining with its high-performance UV laser, high-precision processing capabilities, and proprietary software and control system. It boasts a wide application range and material compatibility, a stable and reliable design, and environmentally friendly, non-contact processing.
The UV laser is 355 nm wavelength, with a “cold marking” method, the laser beam diameter is only 20 μm after focusing, the UV laser’s pulse energy comes in contact with the material in the microsecond. There is no significant thermal influence next to the slit, so no heat damages the electronic component.
- UV laser processing is non-contact processing, stress-free, and will not deform the board.
- It will not produce dust, the cutting edges are smooth and tidy, and there will be no burrs.
- PCBA processing is achievable.
- Any graphics can be processed by Han’s Laser specified software.
- Capable of making FPC, Rigid printed circuit board laser singulation.
- The cutting capacity of the machine is up to 0.004″ to 0.07″ thickness.
- Able to mark 1D, 2D barcode, GS1 code, Series numbers.
- A 2D linear moving stage and high-resolution CCD guarantees high accuracy and precision.
- X-out marking is available as an optional extension.
- Selectable working field size and laser power to meet specific demand.
- Complies with the SMEMA standard.
Click the video below to see our fully automated system design.
Application and Samples
- Applicable for the precise processing of electronic industry like mobile phone fingerprint module, camera module, integrated chip.
- Suitable for precision laser cutting, half cutting, trenching of materials such as FPCBA, PCBA, RF, CVL and SIP.
- Applicable for the high-quality cutting of coverlay, PI, FR4, FR5 and CEM materials.
- Suitable for rigid and flexible substrate cutting and marking, like FR4 substrates and imitation resin-based materials, polyimide, ceramics, Glass, PTFE, polyester, aluminum, brass, and copper, etc.
PCBA Laser Depaneling Solutions
HDZ-UVC3040D
HDZ-CL4030
HDZ-LED300
Technical Specs
| Laser Type | UV Laser |
| Wavelength | 355 nm |
| Min Beam Diameter | < 10 µm |
| Beam Quality M2 | < 1.2 |
| Pulse Frequency | 10 – 200 kHz |
| Output Power | 15/20 Watts |
| Repetition Accuracy | 3 μm |
| Cooling System | Water-cooled |
| Fθ Marking Field Size | 1.96″ x 1.96″ (50mm x 50mm) |
| X, Y travel Distance | 15.74″ x 11.81″ (400mm x 300 mm) |
| Laser Safety Level | Class I |
| Electrical Connection | 110 – 230 V (± 10%) 16 A,50/60 Hz |
| Power Consumed | 6 Kw |
| Dimensions | 41.73″ x 39.37″ x 72.83″ (1060mm x 1000mm x 1850mm) |
| Warranty Coverage | 1-year |
| Laser Safety Compliance | FDA (CDRH) |
| Running Temperature | 15℃-35℃ / 59°-95°F |
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