CO2 PCB Laser Engraving & Marking Machine | PCB Laser Etching

PCB100 Inline/Offline Laser Marking Machine

– PCB laser marking machine for PCB industry.

– HDZ-PCB100 is mainly designed to mark and verify the ECC200 data matrix and other bar codes, batch numbers, and logos.

– Utilize an air-cooled Fiber, CO2 or UV, and green lasers to mark different substrate material and coating, minimizing the damage on the substrate.

– The in-line design fully complies with the SMEMA standard to integrate with the assembly line, through-conveyor is adjustable and programmable to accommodate different size boards.

● Laser power: CO2 Laser.
● Suitable Substrate Size: 2.75″ x 2.75″ (70mm x 70mm)—12.99″ x 9.84″ (330mm x 250mm).
● Suitable Substrate Thickness: 0.023″~0.118″( 0.6mm-3mm).
● Able to mark 1D, 2D barcode, Series numbers, batch number, logo.
● The fully automated PCB laser marking machine is widely used in the circuit board industry.

PCB laser marking can mark various characters, symbols, and patterns, etc. The characters’ size can range from millimeters to micrometers, which can realize the function of anti-counterfeiting. Besides, laser marking can also process serial numbers and QR codes to record related production information, facilitating the complete traceability and quality control of electronic products.

Support SMT integrated
Complies with the SMEMA standard
Supports CAD file (DXF), and PLT/BMP/JPG/Gerber/AI format
Able to mark 1D, 2D barcode, Series numbers, batch number, logo
Use the high-pixel CCD to do the positioning, code reading and checking
Can be equipped with upper and lower triggers to create an offline workstation
Allows for double-sided marking by flipping the product in the marking area

Compared to traditional inkjet marking, laser marking is also more environmentally friendly.

The fully automated PCB laser engraving machine is widely used in the circuit board industry, mainly for assembly line marking operations on integrated circuit boards and semiconductor components, including text or graphic marking.

Due to the non-contact processing method, no mechanical pressure is generated. The laser-focused beam is tiny, which can be used to fine-process small components, including integrated circuits, crystal oscillators, and capacitors.

Inline PCBA Double-sided Marking

Automatic FPC PCB Marking

Applicable for the digital products, wearable devices, automobile PCBA, mobile phone PCBA, FPC and so on.

Rigid and flexible printed circuit board (PCBs)
1D barcodes, 2D Matrix, QR codes, logo, batch number marking

Laser power	CO2 Laser
Wavelength	10.6 µm
Min Beam Diameter	< 100 µm
Min. Character Size	0.023” (0.6mm)
Pulse Frequency	20 – 100 kHz
Output Power	10 Watts
Repetition Accuracy	± 0.0004” (0.01mm)
Cooling System	Water-cooled
Suitable Substrate Size	2.75″ x 2.75″ (70mm x 70mm)—12.99″ x 9.84″ (330mm x 250mm)
Suitable Substrate Thickness	0.023″~0.118″ ( 0.6mm-3mm)
Comply with the height of production line	900±20mm
Marking Field Size	Variable (F100, F160)
Operation System	WINDOWS 10
Profile Laser	Visible, red-beam pilot laser for easy positioning of the work piece
Electrical Connection	110 – 230 V (± 10%) 16 A,50/60 Hz
Power Consumed	1kW
Warranty Coverage	1-year
Laser Safety Compliance	FDA (CDRH)
Running Temperature	15℃-35℃ / 59°-95°F
Equipment Size	43.30″L x 62.99″W x 66.92″ H (1100mm × 1600mm × 1700mm)
Weight	1322 lbs (600kg)