As the semiconductor industry pushes the boundaries of performance and miniaturization, glass substrates are emerging as a vital enabler of advanced packaging. With their excellent thermal stability, electrical insulation, and dimensional accuracy, glass substrates are becoming a preferred choice for high-density interconnect (HDI) applications. However, the processing of Through-Glass Vias (TGVs) presents significant technical challenges due to the material’s brittleness and precision requirements.
Leveraging its deep experience in semiconductor laser applications, Han’s Laser has successfully overcome key hurdles in high-precision TGV laser drilling. The latest breakthrough, the FLEE-TGV laser processing system, plays a crucial role in driving the industrialization of glass-based packaging technologies.
Panel-Level TGV Drilling Solution
The FLEE-TGV system is engineered for panel-level TGV fabrication, offering flexible processing capabilities for a wide variety of via types — including blind vias, shaped vias, and conical vias. Its versatility makes it well-suited for a wide range of industries such as:
- Advanced packaging
- Display manufacturing
- Consumer electronics
- Life sciences
Key Features and Advantages
The FLEE-TGV system integrates advanced hardware and software technologies to deliver high-efficiency, high-precision laser drilling for glass substrates. Its notable features include:
Flexible Size Compatibility
Supports glass panels up to 730 mm × 920 mm, enabling large-format processing across diverse applications.
Femtosecond Laser Technology
Utilizes ultrafast femtosecond laser pulses for clean, high-quality drilling with minimal thermal damage — essential for maintaining substrate integrity.
Proprietary Processing and Control System
Developed in-house, the intelligent software and control architecture ensures consistent performance and adaptive process control for complex drilling tasks.
High-Precision Auto-Calibration System
Integrated vision-based correction system enables micron-level alignment, critical for multi-layer stacking and via registration.
Fully Automated, Lights-Out Operation
Designed for unattended 24/7 production, significantly improving throughput and reducing labor costs.
Independent Intellectual Property
Backed by multiple patents and proprietary core technologies, the FLEE-TGV system reflects Han’s Laser’s leadership in laser-based advanced manufacturing.
Main Parameters
| Panel Size | 730mm x 920mm |
| Panel Thickness | 0.1mm – 1.2mm |
| Efficiency | ≥5000 pieces/S |
| Depth Diameter Ratio | ≥50:1 (depending on glass material) |
| Minimum Aperture | 5um (depending on glass material and thickness) |
| Taper | 1°～10° (depending on glass material) |
| Positional Accuracy | ±5μm |
Driving the Future of Glass Substrate Packaging
Han’s Laser’s FLEE-TGV solution is a key enabler for scaling glass substrate packaging technologies into mass production. By combining cutting-edge femtosecond laser drilling with automation and intelligent control, the system addresses the demanding requirements of modern electronics manufacturing.
As the demand for panel-level integration and ultra-fine interconnects continues to grow, Han’s Laser remains committed to driving innovation through proprietary technology, empowering the advanced packaging with reliable, high-performance laser solutions.