Wafer Laser Marking & Etching Machine | Silicon Wafer Dicing and Scribing System

Wafer Laser Marking / Dicing System

– Class I UV Laser for multiple sizes wafer marking.

– Wafer laser marking machine is widely used in the semiconductor industry due to its apparent advantages, such as high marking accuracy, fast speed, and permanent marking.

– Wafer marking on the die requires good marking quality. High cleanliness levels will ensure traceability and reliability.

● Applicable for the 6-inch, 8-inch and 12-inch wafer marking.
● With UV laser, the focusing spot is fine, and it is non-contact marking.
● Fully-automatic loading and unloading, automatic edge searching, simple operation and high efficiency.
● The whole system adopts computer control, Windows operation platform，interface in English, self-developed software, easy to operate.
● With high automation, it has the function of automatic fault alarm.
● Precise marking to the product DIE.

Wafer Laser Processing – Wafer Marking/Etching

A laser is used to print the lot number (such as ABC1234) directly above the wafer to ensure the entire process chain’s traceability. This lot number is composed of many recessed holes. There may be some derivatives after marking, which will accumulate around the pits. Excessive or hard protrusions may scratch the wafer’s surface in the later process and cause the wafer to be scrapped. Ultraviolet laser processing is a cold processing method that solves accumulation, making it an ideal wafer marking program.

Automatic wafer pick-up from the magazine
Finding wafers automatically with edge seeker
Automatic positioning marking with the visual system
The visual inspection system is available
Available to mark on the backside of the wafer through the transmittance film
Complies with the SMEMA standard
SMIF and other automatic loading and unloading modules can be selected as an extension

UV and Green laser modules can be selected upon to the demand

Wafer Laser Processing – Silicon Wafer Dicing and Scribing

Laser dicing of materials such as Si, SiC, SiO, GaN, etc
Equipped with robotic arms, calibrators, and an automatic ring cleaning structure for fully automated production, effectively improving efficiency
Compatible with 6-inch and 8-inch wafer
The cutting effect has a small heat-affected zone and minimal chipping
Cutting speed exceeds 100 mm/s, cutting depth exceeds 50 μm, and cutting line width exceeds 10 μm
UV and Green laser can be selected upon to the demand

6-inch, 8-inch, 12-inch wafer front or back marking

Laser Type	UV Laser
Wavelength	355 nm
Min Beam Diameter	<10µm
Beam Quality M2	< 1.2
Pulse Frequency	10 – 200 kHz
Output Power	10 Watts
Repetition Accuracy	2 μm
Cooling System	Water-cooled
Fθ Marking Field Size	1.96″ x 1.96″ (50mm x 50mm)
X, Y travel Distance	15.74″ x 11.81″ (400mm x 300 mm)
Laser Safety Level	Class I
Electrical Connection	110 – 230 V (± 10%) 20 A, 50/60 Hz
Power Consumed	5 Kw
Warranty Coverage	1-year
Laser Safety Compliance	FDA(CDRH)
Running Temperature	15℃-35℃ / 59°-95°F