micromachining systems

MICROMACHINING SYSTEMS

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    PCB LASER PROCESS
  • pcb laser engraving

    PCB100 inline/offline Laser Marking Machine

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    – PCB laser marking machine for PCB industry.

    – HDZ-PCB100 is mainly designed to mark and verify the ECC200 data matrix and other bar codes, batch numbers, and logos.

    – Utilize an air-cooled Fiber, CO2 or UV, and green lasers to mark different substrate material and coating, minimizing the damage on the substrate.

    – The in-line design fully complies with the SMEMA standard to integrate with the assembly line, through-conveyor is adjustable and programmable to accommodate different size boards.

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  • PCB Depaneling Machine

    Laser Depaneling PCB Machine HDZ- UVC3030

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    – Laser de-paneling machine for PCB and related industry.

    – The UV laser depaneling machine is assembled with a state-of-the-art 355nm Draco laser module, with fine-tuning, which ensures consistent, high-quality cutting on the fiberglass material (FR4) and flexible PCB.

    – The cold working method produces small heat-affected zones(HAZ), minimizes the charring, and makes minimal mechanical and thermal stress, distortion-free.

    – Equipped with user-friendly software support with a quick parameter setting that produces a clean cut without damaging the substrate and components of the PCBA.

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  • uv laser cutting machine for PCB

    UV Laser De-coating Machine

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    – Class I UV Laser for PCB board glue removal.

    – The UV laser De-coating machine is a high-performance, turnkey laser marking system that can remove glue on critical printed circuit boards with a non-contact, thermal-free, and mechanical stress-free experience.

    – A process contour is generated by an intelligent CCD recognized system to make a quick de-coating without damaging the substrate surface.

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  • WAFER LASER MARKING SYSTEM
  • wafer laser marking machine

    Wafer Laser Marking System

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    – Class I UV Laser for multiple sizes wafer marking.

    – Wafer laser marking machine is widely used in the semiconductor industry due to its apparent advantages, such as high marking accuracy, fast speed, and permanent marking.

    – Wafer marking on the die requires good marking quality. High cleanliness levels will ensure traceability and reliability.

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