Features
When the electronic components are inserted onto the PCB board identified as defective, they need to be removed and replaced with a functioning product. Before that, the glue stuck to the defective product needs to be removed. The traditional method of manual grinding or scraping is used, which is time-consuming, laborious, and the yield of PCB boards after this processing method is not high.
The laser glue/coating removal method is environmentally friendly, has no chemical pollution, fast processing speed, and improved production efficiency.
- Dual intelligent vision CCD systems are used for the edge of the board and fiducial recognition.
- The heat-affected zone and material deformation are small.
- Assemble with X, Y, Z three-axis high accuracy working table.
- Low running cost, an ideal alternative solution to replace hand removal.
- The software supports Serial Port and TCP/IP communication with the client-server.
Application and Samples
Technical Specs
Laser Type | UV De-coating |
Wavelength | 355 nm |
Min Beam Diameter | < 10 µm |
Beam Quality M2 | < 1.2 |
Pulse Frequency | 10 – 200 kHz |
Output Power | 4 Watts |
Repetition Accuracy | ± 0.0001 (0.003mm) |
Cooling System | Water-cooled |
Vision System | high-performance CCD camera |
Operation System | WINDOWS 7 /10 |
Laser Safety Level | Class I |
Electrical Connection | 110 – 230 V (± 10%) 16 A,50/60 Hz |
Power Consumed | 2 kW |
Warranty Coverage | 1- year |
Laser Safety Compliance | FDA (CDRH) |
Running Temperature | 15℃-35℃ / 59°-95°F |
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