micromachining systems
UV Laser De-coating Machine

UV Laser De-coating Machine

– Class I UV Laser for PCB board glue removal.

– The UV laser De-coating machine is a high-performance, turnkey laser marking system that can remove glue on critical printed circuit boards with a non-contact, thermal-free, and mechanical stress-free experience.

– A process contour is generated by an intelligent CCD recognized system to make a quick de-coating without damaging the substrate surface.

Description

Features

When the electronic components are inserted onto the PCB board identified as defective, they need to be removed and replaced with a functioning product. Before that, the glue stuck to the defective product needs to be removed. The traditional method of manual grinding or scraping is used, which is time-consuming, laborious, and the yield of PCB boards after this processing method is not high.

The laser glue/coating removal method is environmentally friendly, has no chemical pollution, fast processing speed, and improved production efficiency.

  • Dual intelligent vision CCD systems are used for the edge of the board and fiducial recognition.
  • The heat-affected zone and material deformation are small.
  • Assemble with X, Y, Z three-axis high accuracy working table.
  • Low running cost, an ideal alternative solution to replace hand removal.
  • The software supports Serial Port and TCP/IP communication with the client-server.

Application and Samples

– PCB with glue
– PCB with coating

Technical Specs

Laser TypeUV De-coating
Wavelength355 nm
Min Beam Diameter< 10 µm
Beam Quality M2< 1.2
Pulse Frequency10 – 200 kHz
Output Power4 Watts
Repetition Accuracy± 0.0001 (0.003mm)
Cooling SystemWater-cooled
Vision Systemhigh-performance CCD camera
Operation SystemWINDOWS 7 /10
Laser Safety LevelClass I
Electrical Connection110 – 230 V (± 10%) 16 A,50/60 Hz
Power Consumed2 kW
Warranty Coverage1- year
Laser Safety ComplianceFDA (CDRH)
Running Temperature15℃-35℃ / 59°-95°F

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