LASER MARKING MACHINES
UV Laser Marking Machine UV-3C-S

UV Laser Marking Machine UV-3C-S

– Laser marking machine for critical and sensitive materials.

– 3W UV laser marking machine, 4W, 7W, 10W, 15W or specified laser power can be customized to meet the production requirement.

– UV-3C-S is a standard single-station design. A turntable dual working station is an optional classic design.

– Class 1 safety design is used to ensure the safety of the operator.

Description

● For critical and sensitive materials.
● Marking field size from 3.93″ x 3.93″ up to 6.29″ x 6.29″, customizable.
● Class 1 safety design is used to ensure the safety of the operator.
● The UV-3C-S laser marking system is a standard single-station design.

Features

The UV laser marking machine uses a 355 nm wavelength UV laser with a “cold marking” method. The laser beam diameter is only 20 μm after focusing. The UV laser’s pulse energy comes in contact with the material in the microsecond. There is no significant thermal influence next to the slit, so no heat damages the electronic component.

  • With cold laser processing and a small heat-affected zone, it can achieve high-quality processing.
  • Wide applicable materials range can compensate for the shortage of infrared laser processing ability.
  • With good beam quality and a small focusing spot, it can achieve superfine marking.
  • High marking speed, high efficiency, and high precision.
  • No consumables, low cost and low maintenance fee.
  • The overall machine has stable performance, supporting the long-term operation.

Han’s Laser UV laser marker quality has been proven in the market for over ten years. More than 50,000+ Han’s Laser UV laser Engravers work with contract manufacturers to help produce electronic parts, auto parts, IC chips, and other high value-added products.

laser etcher machine

Application and Samples

  • UV laser marking of electronic products’ LOGO, model, place of origin
  • UV laser marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm
  • PCB laser marking, PCB laser depaneling, PCB laser singulation
  • Removal of metal or non-metallic coatings
  • Silicon wafer micro-hole and blind hole laser processing
  • Laser marking of low-voltage apparatus and refractory materials

Technical Specs

Laser TypeUV Laser
Wavelength355nm 
Min Beam Diameter < 10 µm
Beam Quality M2< 1.2
Pulse Frequency10 – 200 kHz
Output Power3 Watts
Repetition Accuracy3 μm
Cooling SystemWater-cooled
Marking Field Size3.93″ x 3.93 (100mm x 100mm)
Operation SystemWINDOWS 10
Laser Safety LevelClass I
Electrical Connection110 – 230 V (± 10%) 15 A, 50/60 Hz
Power Consumed≤1500W
Dimensions31.96″ x 33.97″ x 67.99″ (812mm x 863mm x 1727mm)
Weight (unpacked)980 lbs (445kg)
Warranty Coverage1-year
Running Temperature15℃-35℃ / 59°-95°F

Options and Accessories

3 Axis XYZ worktable, Rotary attachment, Jewelry magic grip, Rubber roller, F-Theta focal lens.

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