UV Laser Marking Machine EP-15-THG-F

UV Laser Marking Machine EP-15-THG-F

UV laser marking machine for Integration design.

3W UV laser marking machine, 4W, 7W, 10W, 15W or specified laser power can be customized to meet the production requirement.

EP-15-THG-F is a module design. It is mainly designed to integrate with the automation production line.

Laser marking software could be customized to meet the customer’s unique demand, and the software supports Serial Port and TCP/IP communication with the client-server.



The UV laser engraver uses a 355 nm wavelength UV laser with a “cold marking” method. The laser beam diameter is only 20 μm after focusing. The UV laser act’s pulse energy comes in contact with the material in the microsecond. There is no significant thermal influence next to the slit, so no heat damages the electronic component.

  • With cold laser processing and a small heat-affected zone, it can achieve high-quality processing.
  • Wide applicable materials range can compensate for the shortage of infrared laser processing ability.
  • With good beam quality and a small focusing spot, it can achieve superfine marking.
  • High marking speed, high efficiency, and high precision.
  • No consumables, low cost and low maintenance fee.
  • The overall machine has stable performance, supporting the long-term operation.
  • The machine design is very compact and suitable for automation integration.

Han’s wholly owns the intellectual property rights of the marking software, and strong software development team can customize the software to meet customer needs.

Han’s Laser UV laser marker quality has already been proved in the market for over ten years. More than 50,000+ Han’s Laser UV laser marking machines working in contract manufacturer to help produce electronic parts, auto parts, IC chips, and other high value-added products.

Application and Samples

  1. UV laser marking of electronic product’s LOGO, model, place of origin
  2. UV laser marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm
  3. PCB laser marking, PCB laser depaneling, PCB laser singulation
  4. Removal of metal or non-metallic coatings
  5. Silicon wafer micro-hole and blind hole laser processing
  6. Laser marking of low-voltage apparatus and refractory materials

Technical Specs

Machine TypeEP-15-THG-F
Marking Speed250 Characters Per Second
Type of CoolingWater-Cooling
Mark the Minimum Line Width10μm – 15μm
Laser Power3KW / 4 KW / 7KW / 10KW / 15 KW / 25 KW 
Marking Field Size100mm*100mm
The Standard LensF160
Laser Safety LevelClass IV
Electrical Connection220V 16A, 50/60 Hz
Power Consumed1.5Kw- 2Kw
Warranty Coverage1-year

Options and Accessories

3 Axis XYZ worktable, Rotary attachment, Jewelry magic grip, Rubber roller, F-Theta focal lens.


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