Features
The Green Picosecond Laser uses ultrashort pulses to achieve precise and controlled material removal. The high peak power and short pulse duration help reduce unnecessary heat accumulation during processing, making the technology suitable for fine marking and micromachining applications.
Compared with conventional laser processing, picosecond laser technology provides greater control over energy delivery and material removal, supporting applications that require small features, clean edges, and consistent processing quality.
High-Precision Processing
The combination of picosecond pulse technology and precise motion control supports fine marking, engraving, drilling, cutting, and surface processing.
Reduced Thermal Impact
Ultrashort laser pulses deliver energy within a very short time, helping limit heat diffusion and unwanted thermal effects during precision processing.
Adjustable Processing Parameters
Flexible laser and scanning parameters allow the machine to accommodate different materials and processing requirements.
High-Precision Motorized Z-Axis
The motorized Z-axis provides accurate focus adjustment and stable positioning for consistent processing across different workpiece heights.
Stable Production Operation
The Han’s Laser-developed control hardware and software provide stable operation and support multiple laser waveform modes for production applications.
Enclosed Safety Design
The laser marker features a protective enclosure and laser safety viewing window to provide a controlled processing environment.
Easy Maintenance and Low Operating Costs
The green laser marking machine is designed for stable long-term operation with low energy consumption, convenient maintenance, and multiple equipment configurations for different production environments.
Application and Samples
Suitable for precision marking, engraving, micromachining, drilling, and cutting of metals, ceramics, glass, and electronic components, especially for applications requiring fine features and controlled material removal.
- Precision Metal Marking: supports high-resolution marking on metal components for product identification, traceability, serial numbers, barcodes, and fine graphics.
- Ceramic Micromachining: suitable for precision marking, drilling, cutting, and fine-feature processing of ceramic components used in electronics, semiconductor-related applications, and other precision industries.
- Glass Marking and Micromachining: can be used for fine marking and selected micromachining applications on glass where small features and controlled material removal are required.
- Micro Drilling and Cutting: supports precision drilling and cutting of small features in selected materials, making it suitable for components requiring fine holes, slots, and contours.
- Electronics and Precision Components: suitable for marking and micromachining electronic components, precision parts, and high-value products where small marking features and consistent processing quality are required.
- Medical Components: can be used for precision identification and traceability marking on selected metal and ceramic medical components.
- Surface Processing: can support controlled surface modification, fine engraving, and selective material removal for specialized manufacturing applications.
Typical Materials
- Metals
- Stainless Steel
- Aluminum
- Copper
- Ceramics
- Glass
- Electronic Materials
- Precision Components
- Selected Hard Materials
- Other Laser-Processable Materials
Typical Applications
- Precision Laser Marking
- Product Identification
- Traceability Marking
- Micro Engraving
- Micro Drilling
- Precision Cutting
- Surface Structuring
- Selective Material Removal
- Fine Feature Processing
- Precision Processing for Advanced Manufacturing
Technical Specs
| Item | Parameter |
| Laser Type | Green laser |
| Laser Wavelength | 532 nm |
| Laser Power | Green laser 6 ~ 30 W |
| Pulse Width | ＜10 ps |
| Repetition Frequency | single shot ~ 4000 kHz |
| Marking Lens | F32 ~ F580 (optional) |
| Marking Area | 0.20″ × 0.20″ ~ 15.75″ × 15.75″ (5 × 5 ~ 400 × 400 mm) (optional) |
| Operation System | WINDOWS 10 |
| Marking Line Speed | ≤7000 mm/s |
| Repeatability | ±0.01 mm |
| Electrical Connection | 110 – 230 V (± 10%) 16 A, 50/60 Hz |
| Dimensions | 32″L x 33.98″W x 68″H (812mm x 863mm x1727mm) |
| Weight (Unpacked) | 980 lbs (445kg) |
| Warranty Coverage | 1-year |
| Laser Safety Compliance | FDA (CDRH) |
| Running Temperature | 15℃-35℃ (59° – 95°F) |
| Optional Items | X/Y/Z motion stage, rotary stage, vision module, 3D module, height measurement module, power feedback module, and more. |
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