Features
High-Precision Motorized Z-Axis
The motorized Z-axis provides precise height adjustment and stable positioning, helping maintain consistent processing accuracy across different workpiece geometries and thicknesses.
Ultrashort Pulse Laser Processing
With a pulse width below 15 ps and high peak power, the laser engraver enables precise material removal with reduced heat-affected areas. TEM00 beam output supports fine and consistent processing results.
Adjustable Laser Repetition Rate
The laser repetition rate can be adjusted from 50 kHz to 4,000 kHz to match different materials and processing requirements. High-speed scanning supports efficient micromachining and production applications.
Flexible Laser Waveform Control
Han’s Laser-developed control card and control system support multiple laser waveform modes. Operators can configure processing parameters according to material characteristics and application requirements.
Enclosed Safety Design
The UV laser marking machine is equipped with a protective enclosure and laser safety viewing window to provide a controlled and safer working environment.
Stable and Cost-Efficient Operation
Designed for long-term industrial operation, the machine combines stable performance, low energy consumption, easy maintenance, and reduced operating costs. Multiple laser and equipment configurations are available for different processing requirements and production environments.
Application and Samples
Typical materials include glass, sapphire, ceramics, metals, plastics, oxides, organic materials, and other hard and brittle materials, making it suitable for precision laser processing in advanced manufacturing.
- Brittle Material Micromachining: Suitable for precision processing of glass, sapphire, ceramics, and other brittle materials, including micro-cutting, drilling, and fine-feature processing.
- Precision Glass Marking: Enables high-precision marking on glass, including alignment marks, micro identification codes, and invisible QR codes as small as 0.2 × 0.2 mm.
- Medical Device Traceability: Processes traceability marks on metal medical devices, including marks requiring resistance to acid corrosion and oxidation for demanding medical applications.
- Plastic and Organic Material Processing: Supports cutting, drilling, and surface coating removal on plastics, oxides, and organic materials where precise material removal is required.
- Electronics and Consumer Products: Suitable for fine logo marking and identification on the exterior surfaces of high-end electronic products and precision components.
- Hard Material Micro-Forming: Provides precision shaping and micro-forming capabilities for hard and difficult-to-machine materials.
- Deep Metal Marking: Can be used as an alternative to chemical etching for creating controlled-depth marks and patterns on metal surfaces, reducing reliance on chemical processing.
Technical Specs
| Machine Model | EP-UVPS-08 | ||
| Marking Specification | Output power | UV Pico laser 8W | |
| Lens type | F160 (standard) | F254 (optional) | |
| Marking speed | 300 characters/sec, height=1mm | ||
| Min. character size | 0.06mm | 0.1mm | |
| Min. line width | 15μm | 25μm | |
| Laser Specifications | Wavelength | 355 nm | |
| Beam quality M2 | ≤1.2 | ||
| Power stability (8h) | ＜±1% rms | ||
| Pulse repetition frequency | 50kHz – 1000kHz | ||
| Repetition accuracy | ±0.01mm | ||
| Power consumed | <1.5KW | ||
| Software & System | Supported Fonts | Chinese and English fonts | |
| Operating System | Windows 10 | ||
| Enclosure Protection Rating | IP54 | ||
| Laser Safety Classification | Class 1 | ||
| General Specifications | Cooling Method | Water-Cooled | |
| Operating Temperature | 59–95°F (15–35°C) | ||
| Power Supply | 110V-220V / 50Hz (60Hz) | ||
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