As artificial intelligence penetrates every industry, AI computing power is surging exponentially. This rapid growth places unprecedented thermal demands on hardware systems. Traditional cooling solutions—once sufficient for conventional processors—are now struggling to manage the ultra-high heat flux density generated by high-power chips and heterogeneous computing clusters. In particular, manufacturing limitations in ultra-thin fins, micro-channels, and other precision thermal structures have become major obstacles to improving heat dissipation performance.

Leveraging decades of laser innovation, Han’s Laser has successfully applied 532 nm green laser technology to SLM additive manufacturing. This advancement overcomes the long-standing challenge of energy reflection faced by infrared lasers when processing high-reflectivity copper, opening a reliable path to producing high-density, high-conductivity pure copper components.

Green-Laser SLM: A New Pathway for High-Performance Copper Cooling Components

Built on this breakthrough, the HANS M360G green-laser metal 3D printer introduces a 20 μm laser spot design that delivers exceptionally high power density and precision. This enables the fabrication of high-density, high-precision, high-performance pure copper structures ideal for next-generation thermal management.

To maximize performance, Han’s Laser’s process engineering team developed a fully optimized manufacturing workflow, beginning with customized fine-particle pure copper powders. Through extensive matrix testing—covering laser power, scan speed, hatch spacing, and more—the team established a fine-tuned single-track scanning strategy that stabilizes the melt pool within an extremely narrow range.

This process innovation enables high-quality 0.1 mm ultra-thin wall structures, pushing the boundaries of thermal hardware manufacturing.

Proven Thermal Gains: 40% Better Heat Transfer Performance

Testing data confirms that heat sinks made with 0.1 mm ultra-thin fin structures deliver over 40% higher heat transfer efficiency compared to traditional designs.

With fully integrated 3D-printed geometries, the M360G makes it possible to:

• Fit more fins within the same volume to maximize surface area
• Achieve zero contact thermal resistance, eliminating solder joints and interfaces
• Ensure heat travels along continuous high-conductivity pure copper paths

These benefits make the M360G especially suitable for the instantaneous heat spikes produced by GPU clusters in AI training servers.

Enabling “Thermal-First” Design: Complex Structures Born for Cooling

Metal 3D printing not only improves performance—it enables designs that conventional machining simply cannot produce.

For advanced AI accelerator cards, the HANS M360G can create:

• Chip-conformal geometries that wrap tightly around processors
• Optimized fluid channels that increase heat transfer area
• Enhanced mixing regions that boost convection and eliminate hot spots
• Low-flow-resistance pathways that reduce pump power consumption

These highly customized, high-complexity internal structures are unattainable with subtractive manufacturing, yet seamlessly achievable with green-laser SLM. The result is superior performance in flow resistance, thermal stress distribution, and overall cooling effectiveness.

Pushing the Boundaries of Copper Thermal Design

With its strong capabilities in pure copper processing and micro-scale structural fabrication, the HANS M360G offers a practical path for producing advanced thermal components. From ultra-thin fins to complex flow channels, the system supports the development of next-generation heat management solutions designed for AI infrastructure.

As AI hardware moves toward higher integration and higher power density, thermal management has shifted from a secondary consideration to a key factor that influences computing performance. Metal 3D printing—by enabling geometries that are difficult or impossible to machine conventionally—helps transition thermal design from manufacturing constraints to performance-oriented engineering, providing meaningful support for the continued growth of AI computing systems.

If you are exploring advanced thermal manufacturing solutions or looking to integrate metal 3D printing into your AI hardware development, our team is ready to assist. Reach out to Han’s Laser to discuss your application needs and technical requirements.