Han’s Laser UV depaneling is widely used for diverse of Printed Circuit Boards, which help the customer create productivities and profit.
FPCB
Material :PI
Thickness:80μm
Material :PI+Copper foil
Thickness:25-150μm
PCB
Material:FR4
Thickness:0.012 inch
Material:FR4
Thickness:0.012 inch
Material:FR4
Thickness:0.023 inch
Thickness:0.023 inch
Material:FR4
Thickness:0.043 inch
Thickness:0.043 inch
Fingerprint Sensor IC
Material:FR4+Packing Material
Thickness:0.031 inch
For more information about UV Depaneling, please contact us.
laser@hanslaser.com
408-774-9428
laser@hanslaser.com
408-774-9428
