Han’s Laser is capitalizing on the high-speed growth and accelerated iteration of technological products, coupled with the swift adjustments in industry layouts, by emphasizing technological innovation and accelerating the application pace in integrated circuits and microelectronics. Through collaboration with diverse resources, Han’s Laser is advancing towards the summit of the microelectronics industry.
Innovations in Laser Technology
Today, laser cutting, marking, and welding offer significant advantages over traditional methods, not only in productivity but also in quality. Han’s Laser has developed a range of high-quality, intelligent products and equipment for the microelectronics sector, driving technological innovation and breakthroughs. Han’s Laser provides tailored solutions that cater to the smart transformation and digitalization of the microelectronics industry, pushing for a higher placement in the value chain.
Laser Marking
Wafer Marking
To meet the increasing demands for quality control and process enhancements, and to ensure efficient management and tracking of wafers throughout manufacturing and testing, high-precision marking machines are used. These machines imprint clear, readable characters, barcodes, or QR codes on the surfaces of wafers or dies. Each marking contains crucial information such as the wafer manufacturer’s specific codes and individual wafer serial numbers, ensuring uniqueness and traceability.
Fully Automatic Wafer Laser Marking Equipment
Processing Advantages
1.Fully automated operation with dual-arm robots, significantly enhancing processing efficiency.
2.Equipped with a power detection system and a post-mark inspection system, ensuring consistent processing results.
3.Optional Loadport/SMIF loading modules, further enhancing the equipment’s flexibility and practicality.
Application Scenarios
1.Fully automatic wafer ID marking, DIE marking.
2.Fully automatic wafer film transparency marking.
3.Compatible with both standard and reverse marking processes.
Chip Decapsulation
Chip decapsulation is crucial during the chip design and development phase, enabling subsequent testing and analysis without damaging the chip’s substrate or its overall functionality. This non-contact method offers high-precision and rapid removal of encapsulation material, enhancing yield rates. It is environmentally friendly and broadly applicable in chip and electronic component testing.
Chip Decapsulation Machine
Processing Advantages
1.Applicable to up to 99% of packaging materials, with a 5Mp independent high-resolution camera for precise positioning, ensuring no damage to bonding wires.
2.Specialized decapsulation software for real-time process monitoring.
Application Scenarios
1.Failure Mode Analysis
Detailed electrical tests and physical measurements post-decapsulation to identify specific failure modes and mechanisms.
2.Fault Localization
Direct observation and analysis of the chip’s internal structure to accurately identify fault locations.
3.Sample Preparation and Observation
Preparation for subsequent microscopic observation and analysis.
4.Research and Development
Validation of chip design and reliability through post-decapsulation observations.
Laser Welding
Soldering
Soldering is a welding method that uses tin-based solder alloys heated to melt and fill gaps between metals, forming a metallurgical bond known as the intermetallic compound (IMC) layer, characterizing a permanent connection.
Soldering Equipment
Single-station and dual-station solder ball laser welding machines, Inline laser solder ball jet welding stations, and fully automatic solder ball welding stations for camera modules are part of Han’s Laser’s offerings. These systems precisely control the heat source to achieve efficient and accurate welding.
Single Station Tin Ball Laser Soldering Machine
Dual Station Tin Ball Soldering System
Inline Laser Tin Ball Spray Soldering Station
Application Scenarios
1.Smartphone dual-camera system contact welding.
2.Tablet motherboard contact welding.
3.Mobile phone power button contact welding.
Laser Cutting
SIP Chip Slotting
SIP (System in Package) laser slotting technology is widely used in SIP chip manufacturing, enabling the rapid laser formation of complex slot profiles like T-slots, straight-through slots, V-slots, and Y-slots, essential for diversified SIP packaging needs.
Fully Automatic SIP Laser Cutting Equipment
Processing Advantages
1.Fully automated operation using proprietary control software, high-precision motion systems, scanning galvanometers, and visual positioning systems.
2.Features multi-panel cutting, automatic zoom, and shrink compensation for high-precision machining.
Modern society experiences fast-paced updates and iterations, and there is a strong focus on capturing the window of rapid growth in the microelectronics industry to boost the realization of diversified and visualized industry applications. Han’s Laser is committed to independent innovation and actively invests in capital, resources, and high-tech talent. The company is not only following industry trends but also creating them.
