micromachining systems

WAFER LASER MARKING SYSTEM

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  • wafer laser marking machine

    Wafer Laser Marking / Dicing System

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    Incl. taxes

    – Class I UV Laser for multiple sizes wafer marking.

    – Wafer laser marking machine is widely used in the semiconductor industry due to its apparent advantages, such as high marking accuracy, fast speed, and permanent marking.

    – Wafer marking on the die requires good marking quality. High cleanliness levels will ensure traceability and reliability.

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