In the rapidly evolving landscape of integrated circuits, precision and innovation are the keys to staying ahead. With the burgeoning demand for semiconductor chips across various sectors such as smartphones, IoT, automotive electronics, 5G technology, and artificial intelligence, it is imperative to continually raise the bar for chip quality and reliability. As products become increasingly miniaturized, the production process faces the challenge of detecting even the tiniest defects. In this article, we introduce the DA100 laser cutting system, a groundbreaking solution developed by Han’s Laser, which leverages its extensive industry experience to address these challenges and meet the diverse needs of its customers.
The DA100 Laser Cutting System
Han’s Laser DA100 is a state-of-the-art laser cutting system designed to perform precise separation of semiconductor wafers based on the Ablation process principle. It offers three distinct separation processes for wafers: edge cutting (cutting depth ≤ 20μm, customizable cutting width), partial cutting (cutting depth ≤ 100μm, cutting width ≤ 20μm), and full cutting (cutting depth ≤ 200μm, cutting width ≤ 30μm). The DA100 laser cutting system boasts several remarkable features that set it apart:
Quality Enhancement: The DA100 laser cutting machine effectively suppresses adverse factors such as dust, heat effects, re-melting, and edge crumbling throughout the entire processing cycle, significantly improving product yield and quality.
Expanded Processing Capability: Compared to traditional cutting methods, the DA100 laser cutting system excels in handling wafers up to 200μm in thickness, depending on the material (note that cutting results may vary with different materials).
Multiple Optical Path Options: It offers up to five sets of optical path solutions to accommodate various materials and separation processes.
The Cutting Principle
The DA100 wafer laser cutting system operates on the principles of laser ablation, utilizing the interaction between a high-intensity laser beam and the material. This interaction results in thermal and mechanical effects, causing the material to undergo processes such as heating, melting, and vaporization as laser power density increases.
Key Technical Advantages
Coating Quality: The system ensures uniform coating, resolving issues like incomplete colloidal deposition and residual air bubbles on the cut path. Post-cutting cleaning leaves no contamination.
Edge Trimming: High-precision edge trimming reduces re-melting height to ≤3μm, with further reduction possible through special processes.
Cutting Capability: The DA100 excels in addressing the cutting needs of various small-sized grains (using 100μm thick GaAs product cutting as an example).
Wafer Size: 6”
Wafer Thickness: 100μm thick GaAs
Street Width: 50μm
Street Groove Depth: 15μm
Die Pitch: 180*180μm
Dicing Width: 16±1μm
Vision System: High-definition bottom CCD image system with adjustable focus and a resolution of up to 0.8μm/pixel, preventing misalignment during front-back cutting.
SEMI Certification: The system meets SEMI safety standards, ensuring secure use in semiconductor facilities.
Dust Management: Equipped with a 5-layer protection and filtration system, capable of handling GaAs dust.
Software Functionality: Features like zoning, multiple passes, multi-channel, and multi-step cutting methods cater to various small-grain cutting requirements. Additionally, it includes MPW wafer cutting, remnants, and multiple-piece cutting modes, blade alignment, and full-thickness detection functions, along with customizable 12-step glue cleaning programs.
As the field of laser applications continues to expand and deepen, the demand for laser cutting technology will only increase. Han’s Laser remains committed to driving innovation in technology, processes, and products. By closely monitoring industry trends and meeting the specific cutting needs of its customers, Han’s Laser is poised to play a pivotal role in the rapid development of laser application technology within the semiconductor industry.