Han’s Laser offers advanced laser processing solutions specifically designed for brittle materials, addressing the increasing demand for harder and more brittle materials in industries such as 3C and 5G. These solutions leverage laser micro-nano processing techniques, replacing traditional methods and achieving remarkable improvements in processing efficiency and effectiveness.
The widespread use of brittle materials in various applications, including mobile phones, tablets, TVs, displays, LED/OLED products, integrated circuits, optical devices, medical equipment, and semiconductors, necessitates the use of more advanced laser technology for micro-fine processing. Traditional mechanical equipment struggles to achieve the required efficiency and accuracy in processing brittle materials, making laser technology crucial for meeting the evolving demands of these materials.
Through years of technical advancements and experimentation, laser processing methods have been developed to address the market’s needs for reduced processing steps, material waste, and dry processes. For instance, ultra-fast laser cutting of sapphire thin slices enables clean and precise cuts without cracks, delivering fast processing speeds. Further development of ultrafast laser technology will expand the application fields of brittle materials even further.
Han’s Laser provides a range of laser processing solutions for brittle materials, including:
Utilizing ultra-short pulse lasers, laser cutting machine enables high-speed cutting and drilling of both organic and inorganic materials. The absence of heat conduction and the minimal chipping and heat-affected zone of only 10 μm reduce thermal deformation, ensuring high precision and efficiency.
By melting or vaporizing the material’s surface using a laser beam, laser welding achieves fusion. This versatile technique can be applied to various materials, including metals, non-metals, and composites.
The advantages of laser processing solutions for brittle materials are numerous:
1.High Precision. Laser processing exhibits exceptional precision and repeatability, allowing for extremely accurate processing, especially in small sizes and intricate details.
2.High Efficiency. Laser processing surpasses traditional methods in terms of production efficiency, particularly for batch processing and production scenarios.
3.Automation-Friendly. Laser processing can be easily automated, saving time, reducing labor costs, and minimizing human errors.
4.No Thermal Effects. Laser processing eliminates thermal effects on materials, ensuring their integrity and quality, which traditional methods may compromise.
5.Applicability to Various Materials. Laser processing is suitable for a wide range of materials, including metals, non-metals, and composite materials.
6.Environmental Protection. Laser processing is an environmentally friendly method as it produces minimal pollution compared to traditional processing methods.
7.Thin Plate Laser Cutting Capability. Laser processing enables the cutting of thin plates, reducing material waste and the time and cost associated with post-cutting processing.
In conclusion, Han’s Laser laser processing solutions for brittle materials offer significant advantages in terms of precision, efficiency, environmental protection, and automation. These solutions find widespread application in the field of brittle materials processing, catering to the evolving demands of industries. As the utilization of brittle materials continues to grow, laser technology will remain pivotal in achieving superior results and driving advancements in precision, efficiency, and environmental sustainability.