In the cutting-edge field of semiconductor manufacturing, Han’s Laser, with its deep R&D strength and relentless spirit of innovation, has always been committed to the in-depth exploration of laser cutting application solutions. Recently, our independently developed DA100-A7 PRO laser cutting machine successfully passed customer technical validation and is now ready for mass production. This equipment has broken through the limitations of traditional semiconductor manufacturing technology and has demonstrated outstanding performance in the cutting of SiC substrates, perfectly meeting the diverse needs of semiconductor processes.
Unleashing Potential with DA100-A7 PRO
The DA100-A7 PRO laser cutter represents a significant advancement over traditional semiconductor manufacturing technologies, particularly in the cutting of SiC (Silicon Carbide) substrates. It showcases exceptional performance that meets the diversified needs of semiconductor processes. Upon its release, the machine quickly drew widespread attention within the industry, underscoring its potential impact.
Application
SiC wafers, pivotal in the third-generation semiconductor industry, require precise cutting techniques for applications in RF devices, power devices (including power diodes, transistors, thyristors, MOSFETs, and IGBTs), as well as in emerging sectors like new energy vehicles, photovoltaic power generation, smart grids, rail transportation, and RF communications. The DA100-A7 PRO addresses these needs with unmatched precision and efficiency.
Key Advantages of DA100-A7 PRO
1.Innovative Software and Hardware Architecture
The new architecture ensures no mechanical errors, consistent processing parameters, and guaranteed quality.
2.Streamlined Separation Process
The machine offers a simplified process (eliminating one step and the need for reverse film application), suitable for handling materials under 200μm thick.
3.Precision Imaging
Features a lower CCD resolution of less than 1μm, the highest in the industry, ensuring greater dimensional accuracy.
4.Compatibility
The laser cutter machine is compatible with products up to 8 inches without the need for replacement or upgrades.
5.Proprietary Multi-Optical Path System
Allows switching between different optical paths for efficient processing.
6.Fully Automated Loading and Unloading
Operates completely autonomously, reducing the need for manual oversight.
7.Integrated Automatic Coating and Cleaning Functions
Enhances operational efficiency and maintains high standards of cleanliness.
Future Outlook and Industry Impact
The successful customer validation of the Han’s Laser DA100-A7 PRO is not merely a display of technical prowess but also a sharp insight into market trends and a profound understanding of the industry’s future. Looking ahead, Han’s Laser is committed to significantly increasing its investment in research and development. The goal is to introduce more innovative and high-performance products that will further drive the robust growth of the semiconductor manufacturing industry.
Through relentless innovation and a keen focus on customer needs, Han’s Laser is not just participating in the industry’s evolution; it is actively shaping the future of technology.
